Inventor · Tokyo, JP

Minoru Kakitani

11Patents
1h-index
33Co-inventors
54Inventor score

Filing activity: Feb 13, 2002 → Nov 16, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6720077B2 Resin composition, and use and method for preparing the same Emerging Cross-Sectional Technologies 6 Expired
US11377546B2 Resin composition, laminate sheet, and multilayer printed wiring board Electricity 1 Active
US12024624B2 Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package Electricity 0 Active
US11745482B2 Fluororesin substrate laminate Electricity 0 Active
US12324105B2 Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package Electricity 0 Active
US10907029B2 Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar Electricity 0 Active
US11691389B2 Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition Chemistry; Metallurgy 0 Active
US10940674B2 Resin varnish, prepreg, laminate, and printed wiring board Chemistry; Metallurgy 0 Active
US10876000B2 Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module Chemistry; Metallurgy 0 Active
US7538150B2 Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin Emerging Cross-Sectional Technologies 0 Active
US11136454B2 Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board Chemistry; Metallurgy 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.