Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
US10876082B2 · kind B2 · utility
1Cited by
3References
14Claims
0Family size
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Key dates
| Filing date | Sep 11, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Jan 5, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A surface treatment composition according to the present invention is a surface treatment composition having a pH of lower than 7 and used for treating the surface of a polished object to be polished having a layer containing tungsten, and the surface treatment composition contains a tungsten etching inhibitor and water, wherein the tungsten etching inhibitor is a compound containing a monocyclic or fused polycyclic aromatic hydrocarbon ring having two or more substituents, and the substituents contain at least a nitrogen-containing group and an anionic group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.