Plasma processing apparatus, electrostatic attraction method, and electrostatic attraction program
US10879050B2 · kind B2 · utility
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1References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Dec 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a plasma processing apparatus including: a placing table including a focus ring placed thereon and an electrode provided therein so as to face the focus ring; and a voltage application unit that applies, to the electrode, voltages having different polarities in cycles or a voltage having a large absolute value in steps, during a plasma processing period.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.