Semiconductor package with liquid metal conductors
US10879151B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Dec 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.