Through mold via (TMV) using stacked modular mold rings
US10879152B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2016 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Dec 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided which comprises: a substrate; a stacked ring structure disposed on the substrate, the stacked ring structure comprising a first ring and a second ring; a first partial through-mold-via (TMV) formed on the first ring; and a second partial TMV formed on the second ring, wherein the first ring and the second ring are stacked such that the first partial TMV is aligned on top of the second partial TMV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.