Patent · US Active

Split conductive pad for device terminal

US10879158B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Aniket PATIL · Tempe, US
Hong Bok We · San Diego, US
Kuiwon Kang · San Diego, US
Zhijie Wang · 梅厂镇, CN

Key dates

Filing date	May 29, 2019
Grant date	Dec 29, 2020
Priority date	—
Expiry date	May 29, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Certain aspects of the present disclosure generally relate to a chip package having a split conductive pad for coupling to a device terminal. An example chip package generally includes a layer, a first plurality of conductive pads disposed on the layer, at least one conductive trace disposed on the layer and between the first plurality of conductive pads, and an electrical component having a first terminal coupled to the first plurality of conductive pads and disposed above the at least one conductive trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.