Method for manufacturing a semiconductor device package
US10879215B2 · kind B2 · utility
0Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2019 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Mar 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.