Package structure, die and method of manufacturing the same
US10879224B2 · kind B2 · utility
10Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2019 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Jan 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure, a die and method of forming the same are provided. The package structure includes a die, an encapsulant, a RDL structure, and a conductive terminal. The die has a connector. The connector includes a seed layer and a conductive on the seed layer. The seed layer extends beyond a sidewall of the conductive pillar. The encapsulant is aside the die and encapsulates sidewalls of the die. The RDL structure is electrically connected to the die. The conductive terminal is electrically connected to the die through the RDL structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.