Patent · US Active

Method of fabricating electrically isolated diamond nanowires and its application for nanowire MOSFET

US10879358B2 · kind B2 · utility

0Cited by
3References
8Claims
0Family size

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Key dates

Filing dateMar 20, 2020
Grant dateDec 29, 2020
Priority date
Expiry dateMar 20, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2021/26573
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for fabricating an electrically isolated diamond nanowire includes forming a diamond nanowire on a diamond substrate, depositing a dielectric or a polymer on the diamond nanowire and on the diamond substrate, planarizing the dielectric or the polymer, etching a portion of the planarized dielectric or polymer to expose a first portion of the diamond nanowire, depositing a metal layer to conformably cover the first portion of the diamond nanowire, and implanting ions into a second portion of the diamond nanowire between the first portion of the diamond nanowire and the diamond substrate or at an intersection of the diamond nanowire and the diamond substrate, wherein the ions are implanted at an oblique angle from a first side of the diamond nanowire.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.