Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package
US10880991B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Dec 29, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.