Thomas Ngo
4Patents
1h-index
6Co-inventors
37Inventor score
Filing activity: Jan 28, 2008 → Oct 31, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8686547B1 | Stack die structure for stress reduction and facilitation of electromagnetic shielding | Electricity | 5 | Active |
| US10880991B2 | Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package | Electricity | 0 | Active |
| US9252115B1 | Method for forming semiconductor layout | Electricity | 0 | Active |
| US8796868B1 | Semiconductor layout | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.