Integrated gesture sensor module
US10884551B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2014 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Aug 13, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.