System and method for determining dimensional range of repairable defects by deposition and etching in a virtual fabrication environment
US10885253B2 · kind B2 · utility
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Key dates
| Filing date | Oct 24, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A virtual fabrication environment for semiconductor device fabrication that determines a lowest lithography exposure dose range in which one or more defects are still reparable by deposition and etch operations is discussed. Further techniques for repairing line edge roughness caused by lithography are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.