Method for transferring structures
US10886158B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Jul 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for transferring structures on a host substrate, the method comprising the following steps in sequence: The temporary substrate comprises a matrix made of a stretchable material, and a plurality of inserts on which the structures are assembled, the inserts comprising a material with a Young's Modulus higher than that of the stretchable material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.