Lamine Benaissa
28Patents
2h-index
29Co-inventors
49Inventor score
Filing activity: Jul 15, 2013 → Apr 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9981420B2 | Sensor capable of sensing pressure by means of the deformation of a wrinkled piezoelectric layer | Electricity | 5 | Active |
| US10734439B2 | Method for producing an optoelectronic device comprising a plurality of gallium nitride diodes | Electricity | 2 | Active |
| US11127710B2 | Method for transferring structures | Electricity | 1 | Active |
| US10886158B2 | Method for transferring structures | Electricity | 1 | Active |
| US10357917B2 | Method for manufacturing nanometric objects using the rupture of a layer deformed by wrinkles | Electricity | 1 | Active |
| US11329188B2 | Optoelectronic device manufacturing method | Electricity | 1 | Active |
| US11401162B2 | Method for transferring a useful layer into a supporting substrate | Electricity | 0 | Active |
| US10586810B2 | SOI substrate compatible with the RFSOI and FDSOI technologies | Electricity | 0 | Active |
| US9922953B2 | Process for producing a structure by assembling at least two elements by direct adhesive bonding | Electricity | 0 | Active |
| US11171158B2 | SOI substrate compatible with the RFSOI and FDSOI technologies | Electricity | 0 | Active |
| US10679963B2 | Method for assembling two substrates of different natures via a ductile intermediate layer | Electricity | 0 | Active |
| US10032742B2 | Method for obtaining a bonding surface for direct bonding | Emerging Cross-Sectional Technologies | 0 | Active |
| US10115698B2 | Method for direct adhesion via low-roughness metal layers | Electricity | 0 | Active |
| US12234144B2 | Method for sealing cavities using membranes | Performing Operations; Transporting | 0 | Active |
| US10183441B2 | Method for obtaining a wavy layer locally suspended on a substrate using a deformation by formation of wrinkles | Electricity | 0 | Active |
| US11955375B2 | Composite structure, intended for a planar co-integration of electronic components of different functions | Electricity | 0 | Active |
| US11024544B2 | Assembly for 3D circuit with superposed transistor levels | Electricity | 0 | Active |
| US11952808B2 | Device for locking and/or unlocking a motor vehicle opening panel, vehicle comprising said device and method for locking or unlocking a motor vehicle opening panel using said device | Fixed Constructions | 0 | Active |
| US9997394B2 | Method for transferring a thin layer with supply of heat energy to a fragile zone via an inductive layer | Electricity | 0 | Active |
| US12349593B2 | Functionalized object with integrated mechanical wave sensor and associated production method | Electricity | 0 | Active |
| US9472530B2 | Method for carrying out a conductive direct metal bonding | Electricity | 0 | Active |
| US10403597B2 | Direct bonding method | Electricity | 0 | Active |
| US9777393B2 | Method for producing a single-crystalline layer | Emerging Cross-Sectional Technologies | 0 | Active |
| US11601107B2 | Method for the production of a bulk acoustic wave resonator with a reduced parasitic capacitance | Electricity | 0 | Active |
| US9735038B2 | Process for manufacturing a semiconductor structure with temporary bonding via metal layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.