Semiconductor device package, electronic assembly and method for manufacturing the same
US10886208B2 · kind B2 · utility
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1References
16Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 31, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Jan 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.