Double-sided module with electromagnetic shielding
US10888040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2018 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Apr 20, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49789
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.