Sensors with a non-planar sensing structure
US10890554B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Jun 20, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/60
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Structures for a sensor and fabrication methods for a sensor. Features each having a top surface and a plurality of side surfaces are formed. A sensing layer is formed on the top surface and the side surfaces of each feature, and an interconnect structure having one or more interlayer dielectric layers is formed over the features. The one or more interlayer dielectric layers include a cavity arranged to expose the sensing layer, and the sensing layer is composed of a material that is sensitive to a property of an analyte solution provided in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.