Optical interconnect for switch applications
US10890719B2 · kind B2 · utility
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Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Nov 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2011/0022
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.