Method for creating a fully self-aligned via
US10892187B2 · kind B2 · utility
1Cited by
32References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76883
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods to provide a fully self-aligned via are described. Some embodiments of the disclosure provide an electronic device having a bridging via between a first metallization and a third metallization layer, the bridging via not contacting a second metallization layers. Methods of providing self-aligned bridging vias are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.