Media shield with EMI capability for pressure sensor
US10892229B2 · kind B2 · utility
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16References
11Claims
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Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Apr 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.