Circuit structure and chip package
US10892238B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 16, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit structure including a first signal line and a second signal line is provided. The first signal line includes a first line segment, a first ball grid array pad, and a first through hole disposed between the first line segment and the first ball grid array pad. The second signal line includes a second line segment, a second ball grid array pad, and a second through hole disposed between the second line segment and the second ball grid array pad. In a plan view, a line connecting the center of the first ball grid array pad and the center of the second ball grid array pad has a first distance, a line connecting the center of the first through hole and the center of the second through hole has a second distance, and the first distance is less than the second distance. A chip package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.