High density ball grid array (BGA) package capacitor design
US10892316B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Mar 29, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit package is provided that includes a substrate having a first side and a second side, an integrated circuit component coupled to the second side of the substrate, and a ball grid array formed on the first side of the substrate, the ball grid array including multiple contact balls arranged in a pattern. Each of a first subset of the contact balls is electrically coupled to a first voltage input of an integrated circuit component, and each of a second subset of the contact balls is electrically coupled to a second voltage input of the integrated circuit component. The package also includes a capacitor mounted to the first side and having a first terminal coupled to a first contact ball in the first subset of the contact balls and a second terminal coupled to a second contact ball in the second subset of the contact balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.