Scott Kirkman
12Patents
7h-index
8Co-inventors
59Inventor score
Filing activity: Aug 20, 1992 → Sep 11, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5903050A | Semiconductor package having capacitive extension spokes and method for making the same | Electricity | 158 | Expired |
| US6064113A | Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances | Electricity | 78 | Expired |
| US6137168A | Semiconductor package with traces routed underneath a die | Electricity | 50 | Expired |
| US7007741B2 | Conformal heat spreader | Electricity | 27 | Expired |
| US5793104A | Apparatus for forming electrical connections between a semiconductor die and a semiconductor package | Electricity | 9 | Expired |
| US5337614A | Fixture for testing mounting integrity of heat sinks on semiconductor packages, and method of testing | Physics | 9 | Expired |
| US5911112A | Method for forming electrical connections between a semiconductor die and a semiconductor package | Electricity | 7 | Expired |
| US5992012A | Method for making electrical interconnections between layers of an IC package | Emerging Cross-Sectional Technologies | 5 | Expired |
| US11784215B2 | Deep trench capacitors embedded in package substrate | Electricity | 1 | Active |
| US10892316B2 | High density ball grid array (BGA) package capacitor design | Emerging Cross-Sectional Technologies | 1 | Active |
| US12238940B2 | Deep trench capacitors embedded in package substrate | General | 0 | Revoked |
| US12274079B2 | Deep trench capacitors embedded in package substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.