System in package with double side mounted board
US10896877B1 · kind B1 · utility
0Cited by
19References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2018 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Dec 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved SiP structure includes one or more interposers positioned to form a center cavity into which one or more electronic components can be mounted. The improved SiP structure provides a reduced footprint using the one or more interposers and formed center cavity without the need of laser drilling, exposed molding, and/or double side molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.