Inventor · Shanghai, CN

Cheng Yang

23Patents
4h-index
26Co-inventors
59Inventor score

Filing activity: Sep 26, 2007 → Dec 22, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8017183B2 Organosiloxane materials for selective area deposition of inorganic materials Chemistry; Metallurgy 30 Active
US8030212B2 Process for selective area deposition of inorganic materials Electricity 16 Active
US7846644B2 Photopatternable deposition inhibitor containing siloxane Physics 5 Active
US11189622B1 Semiconductor device with graphene layer and method for forming the same Electricity 4 Active
US8129098B2 Colored mask combined with selective area deposition Electricity 3 Active
US10620221B2 Devices and assays for diagnosis of sinusitis Physics 2 Active
US10629561B2 Overlapping stacked die package with vertical columns Electricity 2 Active
US11682603B2 Control of thermal interface material in multi-chip package Electricity 1 Active
US10256208B2 Overlapping stacked die package with vertical columns Electricity 1 Active
US12243850B2 Devices, systems, and methods for stacked die packages Electricity 0 Active
US11652151B2 Semiconductor device structure with fine conductive contact and method for preparing the same Electricity 0 Active
US11521978B2 Semiconductor device and method for fabricating the same Electricity 0 Active
US12368324B2 Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package Electricity 0 Active
US11304302B2 Methods of creating exposed cavities in molded electronic devices Electricity 0 Active
US12237209B2 Method of manufacturing memory device having active area in elongated block Electricity 0 Active
US9936582B2 Integrated circuit assemblies with molding compound Emerging Cross-Sectional Technologies 0 Active
US11723151B2 Methods of creating exposed cavities in molded electronic devices Electricity 0 Active
US11114448B2 Semiconductor device and method for fabricating the same Electricity 0 Active
US12278138B2 Method of manufacturing memory device with first and second isolation members using patterned photoresist layer and energy-decomposable mask Electricity 0 Active
US11270974B2 Embedded copper structure for microelectronics package Electricity 0 Active
US11114536B1 Semiconductor device having multiple dimensions of gate structures and method for fabricating the same Electricity 0 Active
US10896877B1 System in package with double side mounted board Electricity 0 Active
US11699734B2 Semiconductor device with resistance reduction element and method for fabricating the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.