Pattern measuring method, pattern measuring tool and computer readable medium
US10903041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2019 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | May 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a pattern measuring method to appropriately measure a height and a depth of a pattern having a high aspect ratio. The method includes measuring a width between a first pattern and another pattern formed on a wafer; calculating a value regarding an azimuth angle of a signal emitted from the wafer; and calculating height information from a portion between the first pattern and the other pattern to an upper portion of a pattern based on the measured width between the first pattern and the other pattern, the value regarding the azimuth angle, the value regarding an elevation angle, and relationship information thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.