Electrical interconnections with improved compliance due to stress relaxation and method of making
US10903137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2019 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Aug 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49822
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various embodiments of the present disclosure, an electrically conductive pillar having a substrate is disclosed. The electrically conductive pillar can comprise a first portion, second portion and a third portion. The first portion and/or third portion can be formed of an electrically conductive material that can be the same or different. The second portion can be intermediate and abut both the first portion and the third portion. The second portion can comprise a solder element formed of a second electrically conductive material that differs from the electrically conductive material and has a second stiffness less than a stiffness of the electrically conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.