Patent · US Active

System and method for making micro LED display

US10903267B2 · kind B2 · utility

1Cited by

2References

18Claims

0Family size

Inventors

Bor-Jen Wu · Taipei, TW
Chia-Bin Tsen · New Taipei, TW

Key dates

Filing date	Apr 4, 2019
Grant date	Jan 26, 2021
Priority date	—
Expiry date	Jul 11, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

By using chip-by-chip, mainly separation technology, micro LED can be made very accurately and efficiently. First, after epitaxial process, the LED epi-wafer is processed into micro LEDs. Second, bonding substrates with driving circuits are provided for the LED epi-wafer. Then, each LED chip is fastened to the substrate chip-by-chip simultaneously or sequentially, and each LED chip may be transferred by using separation technology simultaneously or sequentially. The LED epi-wafer per se can be also provided as LED display substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.