Methods for attachment and devices produced using the methods
US10905041B2 · kind B2 · utility
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11References
22Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 16, 2013 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Sep 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24893
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.