Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
US10907029B2 · kind B2 · utility
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16Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 19, 2017 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Oct 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/012
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.