Method of controlling an adjustable nozzle and method of making a semiconductor device
US10910199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of controlling a position of an adjustable nozzle includes depositing a film on a surface of a wafer. The method includes measuring a thickness profile of the surface of the wafer. The method includes comparing the measurement of the thickness profile with a reference value using a control unit. The method includes transmitting a control signal to the adjustable nozzle to alter the position of the adjustable nozzle based on the result of the comparison. The adjustable nozzle includes a base having a hollow center portion for conducting gas, the base configured for connection to a gas source. The adjust nozzle includes a tip coupled to the base and having an opening for conducting gas from the base to the exterior of the nozzle, wherein the base is configured for pivoting about a longitudinal axis of the base in response to the control signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.