Inventor · Hsinchu, TW

Ding-I Liu

45Patents
3h-index
53Co-inventors
62Inventor score

Filing activity: Aug 18, 2011 → Mar 19, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9716044B2 Interlayer dielectric structure with high aspect ratio process (HARP) Electricity 9 Active
US10533252B2 Showerhead, semicondcutor processing apparatus having the same and semiconductor process Electricity 8 Active
US9490152B2 Asymmetrical chamber configuration Emerging Cross-Sectional Technologies 5 Active
US9607873B2 Apparatus and operation method thereof Electricity 3 Active
US10161041B2 Thermal chemical vapor deposition system and operating method thereof Chemistry; Metallurgy 3 Active
US9941100B2 Adjustable nozzle for plasma deposition and a method of controlling the adjustable nozzle Chemistry; Metallurgy 2 Active
US10749004B2 Semiconductor device having a multi-layer diffusion barrier Electricity 2 Active
US9573144B2 Coating apparatus and method of forming coating film Electricity 2 Active
US11194259B2 Equipment module with enhanced protection from airborne contaminants, and method of operation Electricity 1 Active
US11264467B2 Semiconductor device having multi-layer diffusion barrier and method of making the same Electricity 1 Active
US10626499B2 Deposition device structure Chemistry; Metallurgy 1 Active
US10864530B2 Coating apparatus and method of forming coating film Electricity 1 Active
US10867787B2 Method for controlling plasma in semiconductor fabrication Human Necessities 1 Active
US11315829B2 Amorphous layers for reducing copper diffusion and method forming same Electricity 1 Active
US10164063B2 Semiconductor structure with protection layer Electricity 0 Active
US9536771B2 Gap fill self planarization on post EPI Electricity 0 Active
US8803249B2 Profile pre-shaping for replacement poly gate interlayer dielectric Electricity 0 Active
US10724140B2 Thermal chemical vapor deposition system and operating method thereof Chemistry; Metallurgy 0 Active
US10978337B2 Aluminum-containing layers and methods of forming the same Electricity 0 Active
US11742393B2 Semiconductor device having a multi-layer diffusion barrier and method of making the same Electricity 0 Active
US9607809B2 High density plasma reactor with multiple top coils Electricity 0 Active
US8946095B2 Method of forming interlayer dielectric film above metal gate of semiconductor device Electricity 0 Active
US9048185B2 Profile pre-shaping for replacement poly gate interlayer dielectric Electricity 0 Active
US12020947B2 Method of manufacturing semiconductor devices and semiconductor devices Electricity 0 Active
US9831307B2 Gap fill self planarization on post EPI Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.