Silver sintering preparation and the use thereof for the connecting of electronic components
US10910340B1 · kind B1 · utility
2Cited by
0References
15Claims
0Family size
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Key dates
| Filing date | Oct 14, 2019 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Oct 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A silver sintering preparation comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.