Package structure and manufacturing method thereof
US10914895B2 · kind B2 · utility
3Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2018 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Sep 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure including a plurality of first dies and an insulating encapsulant is provided. The plurality of first dies each include a first waveguide layer having a first waveguide path of a bent pattern, wherein the first waveguide layers of the plurality of first dies are optically coupled to each other to form an optical route. The insulating encapsulant encapsulates the plurality of first dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.