Raising maximal silicon die temperature using reliability model
US10915154B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2019 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Aug 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B13/042
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method includes obtaining (i) an operating-temperature profile of a hardware processing sub-unit (HPSU) of a network element as a function of time, and (ii) a dependence of an Equivalent Reliability Time (ERT) of the HPSU on operating temperature. The operating-temperature profile is weighted using the dependence of the ERT on operating temperature, to estimate an effective ERT of the HPSU. An operating condition of the HPSU in the network element is modified, depending on the effective ERT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.