Surface treatment composition, method of producing surface treatment composition, method of treating surface, and method of producing semiconductor substrate
US10916435B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2017 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Oct 11, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a means for sufficiently removing organic residues remaining on the surface of an object to be polished which contains silicon nitride, silicon oxide, or polysilicon and has been polished. The present invention relates to a surface treatment composition including a polymer compound having a sulfonic acid (salt) group and water, wherein the surface treatment composition has a pH value of less than 7 and the surface treatment composition is used for decreasing an organic residue on a surface of an object to be polished which contains silicon nitride, silicon oxide, or polysilicon and has been polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.