Methods of forming micropatterns and substrate processing apparatus
US10916437B2 · kind B2 · utility
0Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2018 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Dec 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.