Package of integrated circuits having a light-to-heat-conversion coating material
US10916450B2 · kind B2 · utility
3Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Nov 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, decomposing a first portion of the release film to separate a second portion of the release film from the carrier, and forming an opening in the release film to expose the metal post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.