Patent · US Active

Stacked dice systems

US10916524B2 · kind B2 · utility

0Cited by

37References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Kooi Chi Ooi · Air Itam, MY
Ping Ping Ooi · Butterworth, MY

Key dates

Filing date	Nov 29, 2017
Grant date	Feb 9, 2021
Priority date	—
Expiry date	Nov 29, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10D84/40
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Discussed generally herein are devices that can include multiple stacked dice electrically coupled to dice electrically coupled to a peripheral sidewall of the stacked dice and/or a dice stack electrically coupled to a passive die. In one or more embodiments a device can include a dice stack comprising at least two dice including a first die and a second die, the first die electrically connected to and on a second die, a first side pad on, or at least partially in, a first sidewall of the dice stack, a third die electrically connected to the first die at a first surface of the third die and through the first side pad, and a fourth die electrically connected to the third die at a second surface of the first die, the second side opposite the first side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.