Inventor · Butterworth, MY

Ping Ping Ooi

18Patents
2h-index
24Co-inventors
50Inventor score

Filing activity: Jun 29, 2012 → Oct 27, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US8890302B2 Hybrid package transmission line circuits Electricity 3 Active
US11121074B2 Packaged die stacks with stacked capacitors and methods of assembling same Electricity 2 Active
US10388636B2 Integrating system in package (SIP) with input/output (IO) board for platform miniaturization Electricity 2 Active
US10317938B2 Apparatus utilizing computer on package construction Electricity 2 Active
US10541200B2 Over-molded IC packages with embedded voltage reference plane and heater spreader Electricity 1 Active
US10593618B2 Packaged die stacks with stacked capacitors and methods of assembling same Electricity 1 Active
US10998261B2 Over-molded IC package with in-mold capacitor Electricity 1 Active
US11164827B2 Substrate with gradiated dielectric for reducing impedance mismatch Electricity 1 Active
US10403604B2 Stacked package assembly with voltage reference plane Electricity 1 Active
US11521932B2 Composite bridge die-to-die interconnects for integrated-circuit packages Electricity 0 Active
US10916524B2 Stacked dice systems Electricity 0 Active
US9543244B2 Hybrid package transmission line circuits Electricity 0 Active
US12142570B2 Composite bridge die-to-die interconnects for integrated-circuit packages Electricity 0 Active
US11837458B2 Substrate with gradiated dielectric for reducing impedance mismatch Electricity 0 Active
US12002793B2 Integrating system in package (SiP) with input/output (IO) board for platform miniaturization Electricity 0 Active
US10980108B2 Multi-conductor interconnect structure for a microelectronic device Electricity 0 Active
US11355458B2 Interconnect core Electricity 0 Active
US11114421B2 Integrating system in package (SiP) with input/output (IO) board for platform miniaturization Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.