Low melting temperature metal purification and deposition
US10916761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2017 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Jul 12, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Implementations described herein generally relate to low melting temperature metal or alloy metal deposition and processing. More particularly, the implementations described herein relate to methods and systems for low melting temperature metal or alloy metal deposition and processing for printed electronics and electrochemical devices. In yet another implementation, a method is provided. The method comprises exposing a molten metal source to a purification process to remove unwanted quantities of contaminants, delivering the filtered molten metal to a three dimensional printing device, and forming a metal film on a substrate by printing the filtered molten metal on the substrate. The purification process comprises delivering the molten metal to a filter assembly, wherein the filter assembly includes at least one of: a skimmer device, a metal mesh filter, and a foam filter, and filtering the molten metal through the filter assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.