Semiconductor package structure having antenna module
US10916829B2 · kind B2 · utility
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9Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 26, 2018 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Dec 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package structure having an antenna module includes: a substrate, having at least one via hole running through the substrate; a rewiring layer, disposed on a surface of the substrate; a metal bump, disposed on and electrically connected to the rewiring layer; a semiconductor chip, disposed on and electrically connected to the rewiring layer; a conductive column, filling the via hole; a plastic packaging material layer, surrounding the metal bump and the semiconductor chip; and an antenna module, electrically connected to the metal bump through the conductive column and the rewiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.