3D SRAM/ROM with several superimposed layers and reconfigurable by transistor rear biasing
US10923191B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
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Key dates
| Filing date | Jul 12, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jul 12, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/419
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A 3D microelectronic device is provided with several superimposed layers of components, with an upper layer including one or several memory cells having a SRAM structure and provided with a rear biasing electrode. The biasing of the rear biasing electrode is modified to switch the memory cells from a ROM operating mode to a SRAM operating mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.