Patent · US Active

Device and methods for the transfer of chips from a source substrate onto a destination substrate

US10923460B2 · kind B2 · utility

0Cited by

3References

7Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Stéphane Caplet · Saint-Égrève, FR
Laurent Mollard · Grenoble, FR

Key dates

Filing date	Jun 24, 2019
Grant date	Feb 16, 2021
Priority date	—
Expiry date	Jul 10, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/036
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for the transfer of chips from a source substrate onto a destination substrate, including: a source substrate having a lower surface and an upper surface; and a plurality of elementary chips arranged on the upper surface of the source substrate, wherein each elementary chip is suspended above the source substrate by at least one breakable mechanical fastener, said at least one breakable mechanical fastener having a lower surface fastened to the upper surface of the source substrate and an upper surface fastened to the lower surface of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.