Stéphane Caplet
22Patents
4h-index
25Co-inventors
63Inventor score
Filing activity: Feb 13, 1997 → Dec 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6392158B1 | Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6029517A | Miniaturized accelerometer of the type using spring compensation of the effect of gravity and its production process | Physics | 7 | Expired |
| US6546623B2 | Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5922955A | Gravity-compensation type accelerometer and process for producing such an accelerometer | Physics | 4 | Expired |
| US8367929B2 | Microcavity structure and encapsulation structure for a microelectronic device | Emerging Cross-Sectional Technologies | 3 | Active |
| US9005353B2 | Getter structure including a gas-permeable material description | Performing Operations; Transporting | 2 | Active |
| US6878566B2 | Method of reinforcing a mechanical microstructure | Physics | 1 | Expired |
| US7700457B2 | Method and zone for sealing between two microstructure substrates | Performing Operations; Transporting | 1 | Expired |
| US6861719B2 | Device for detecting three-dimensional electromagnetic radiation and method for making same | Electricity | 1 | Expired |
| US8138556B2 | Pre-released structure device | Performing Operations; Transporting | 1 | Active |
| US9309110B2 | Method of encapsulating a microelectronic device by a getter material | Performing Operations; Transporting | 0 | Active |
| US11430373B2 | LED display device | Electricity | 0 | Active |
| US8557698B2 | Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops | Performing Operations; Transporting | 0 | Active |
| US9260291B2 | Suspended getter material-based structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US11404401B2 | Process for manufacturing an LED-based emissive display device | Electricity | 0 | Active |
| US11908832B2 | Process for collectively bending microelectronic components using shaping carrier | Electricity | 0 | Active |
| US9063410B2 | Method for making micron or submicron cavities | Physics | 0 | Active |
| US11302677B2 | Process for manufacturing an LED-based emissive display device | Electricity | 0 | Active |
| US8324695B2 | Electronic component with mechanically decoupled ball connections | Electricity | 0 | Active |
| US10991738B2 | Method for producing curved electronic circuits | Electricity | 0 | Active |
| US10923460B2 | Device and methods for the transfer of chips from a source substrate onto a destination substrate | Electricity | 0 | Active |
| US8288841B2 | Handle wafer having viewing windows | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.