LED sidewall processing to mitigate non-radiative recombination
US10923626B2 · kind B2 · utility
1Cited by
6References
17Claims
0Family size
Inventors
Key dates
| Filing date | Aug 21, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Aug 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
Abstract
LEDs and methods of forming LEDs with various structural configurations to mitigate non-radiative recombination at the LED sidewalls are described. The various configurations described include combinations of LED sidewall surface diffusion with pillar structure, modulated doping profiles to form an n-p superlattice along the LED sidewalls, and selectively etched cladding layers to create entry points for shallow doping or regrowth layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.