Method and system for mass assembly of thin film materials
US10926521B2 · kind B2 · utility
1Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Jan 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers in parallel to a target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.