JengPing Lu
68Patents
10h-index
57Co-inventors
81Inventor score
Filing activity: Dec 21, 1999 → Jul 12, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6290510A | Spring structure with self-aligned release material | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6912082B1 | Integrated driver electronics for MEMS device using high voltage thin film transistors | Performing Operations; Transporting | 51 | Expired |
| US6361331B1 | Spring structure with self-aligned release material | Emerging Cross-Sectional Technologies | 32 | Expired |
| US7517769B2 | Integrateable capacitors and microcoils and methods of making thereof | Electricity | 28 | Active |
| US9154138B2 | Stressed substrates for transient electronic systems | Electricity | 24 | Active |
| US9577047B2 | Integration of semiconductor epilayers on non-native substrates | Electricity | 22 | Active |
| US9305807B2 | Fabrication method for microelectronic components and microchip inks used in electrostatic assembly | Electricity | 16 | Active |
| US8618865B1 | Capacitive imaging device with active pixels | Physics | 15 | Active |
| US6658728B2 | Method for fabricating a spring structure on a substrate | Emerging Cross-Sectional Technologies | 15 | Expired |
| US9431283B2 | Direct electrostatic assembly with capacitively coupled electrodes | Electricity | 11 | Active |
| US6794725B2 | Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources | Electricity | 10 | Expired |
| USRE47570E1 | Stressed substrates for transient electronic systems | General | 5 | Active |
| US9156194B2 | Digital 3D fabrication using multi-layered mold | Performing Operations; Transporting | 5 | Active |
| US11242244B2 | Method of controlling the placement of micro-objects on a micro-assembler | Emerging Cross-Sectional Technologies | 4 | Active |
| US9952122B2 | Polysensing bioelectronic test plate | Physics | 3 | Active |
| US11302554B2 | Micro assembler with fine angle control | Electricity | 1 | Active |
| US8685769B1 | Microchip charge patterning | Electricity | 1 | Active |
| US10926521B2 | Method and system for mass assembly of thin film materials | Electricity | 1 | Active |
| US7886662B2 | Digital printing plate and system with electrostatically latched deformable membranes | Electricity | 1 | Active |
| US9473047B2 | Method for reduction of stiction while manipulating micro objects on a surface | Electricity | 1 | Active |
| US11787167B2 | Secondary roller for fountain solution contact angle pinning | Performing Operations; Transporting | 1 | Active |
| US7227237B2 | Systems and methods for biasing high fill-factor sensor arrays and the like | Electricity | 1 | Expired |
| US9997837B1 | Rectifying devices and fabrication methods | Electricity | 1 | Active |
| US10964582B2 | Transfer substrate utilizing selectable surface adhesion transfer elements | Electricity | 1 | Active |
| US9946135B2 | High voltage thin film optical switch | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.