Workpiece grinding method
US10933503B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Nov 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A workpiece grinding method including a first surface protection step of covering a front surface of a workpiece with a workpiece protective member, a second surface protection step of covering front surface of a support substrate with a support substrate protective member, a workpiece unit formation step of causing an adhesive to spread over a side surface of an outer peripheral portion of the workpiece to fix the side surface to the support substrate, and forming a workpiece unit, a grinding step of thinning the workpiece, a first peeling step of peeling off the workpiece after thinning, the workpiece protective member, the adhesive, and the support substrate protective member from the support substrate as one unit in such a manner to turn them over, and a second peeling step of peeling off the workpiece protective member, the adhesive, and the support substrate protective member as one unit from the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.